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About us
 Shenzhen KingshengPCBA Tech Co.,Ltd (HK C-Alley Co.,Ltd), an professional PCBA manufactuer and electronics manufacturing service (EMS) provider for 12years.SMT factory has ISO9001, ISO14001, TS16949 certification, advanced production equipment and rich experience in the production of PCBA. more

What's BGA
What's BGA
 
BGA's full name is Ball Grid Array, which is an array of solder balls on the bottom of the package substrate as the I/O end of the circuit and the printed circuit board (PCB). The device packaged with this technology is a surface mount device.
 
BGA packaging emerged in the early 1990s and has evolved into a mature high-density packaging technology. Among all the package types of semiconductor ICs, the BGA package grew fastest during the five years from 1996 to 2001. In 1999, the output of BGA was about 1 billion. However, to date, this technology has been limited to packages of high-density, high-performance devices, and the technology is still moving toward fine pitch and high I/O ends. BGA packaging technology is mainly suitable for PC chipset, microprocessor/controller, ASIC, gate array, memory, DSP, PDA, PLD and other devices.