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About us
 Shenzhen KingshengPCBA Tech Co.,Ltd (HK C-Alley Co.,Ltd), an professional PCBA manufactuer and electronics manufacturing service (EMS) provider for 12years.SMT factory has ISO9001, ISO14001, TS16949 certification, advanced production equipment and rich experience in the production of PCBA. more

DIP Solder process
DIP Solder process
 
Dip soldering is accomplished by immersing the components to be joined in a molten solder bath.
Therefore, all parts are coated with a filler metal.
Solder has low surface tension and high wetting ability. There are many types of solders, each for different applications.
For example lead-silver, the strength is higher than room temperature. Tin-lead for general purpose;
Tin zinc is used for aluminum; cadmium - silver is used for high temperature strength;
Zinc aluminum for aluminum and corrosion resistance;
Tin - Silver and Tin - 铋 for electronic products. Lead-free solders are being developed and are being used more widely due to the toxicity of lead.
The molten bath can be any suitable filler metal, but the choice is generally limited to lower melting elements.
The most common dip soldering operations use zinc aluminum and tin-lead solder.
Solder pot metal - cast iron or steel, electrically heated.
Bath temperature - 220 degrees Celsius to 260 degrees Celsius (binary tin-lead alloy)
Bath temperature - 350 degrees Celsius to 400 degrees Celsius. Celsius (for lead-free alloys)
Solder composition - 60% Sn (tin), 40% Pb (lead) or eutectic alloy.