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 Shenzhen KingshengPCBA Tech Co.,Ltd (HK C-Alley Co.,Ltd), an professional PCBA manufactuer and electronics manufacturing service (EMS) provider for 12years.SMT factory has ISO9001, ISO14001, TS16949 certification, advanced production equipment and rich experience in the production of PCBA. more

Attention for BGA Layout Design during PCBA processing
Attention for BGA Layout Design during PCBA processing
BGA has a large pad package but the solder jointa is small.
BGA layout design requirements
1.Place the PCB near the transfer side as close as possible. Because the deformation is relatively small during soldering.
2.Avoid layout at the corners of the L-shaped plate and near the crimp connector.
3.Avoid mirroring the front and back side. If it is necessary, the thickness of the PCB should be ≥ 2.0mm, which is mainly considered from the long-term reliability. The reliability of the mirror layout BGA will be reduced more than 50%.
4.The PBGA should avoid to layout on the first assembly surface (first welding surface, Bottom surface).
5.The BGA should be avoided to near the edge of the imposition.