About Usmore

About us
    Shenzhen Kingsheng PCBA Tech Co.,LTD (H.K. C-Alley Co.,LTD) was founded in the year 2002, mainly business are automotive cables, PCBA and electornic products trade, all the products were exported to foreign markets, mainly to Eastern Europe market. Since year 2005, Kingsheng begin to focus on PCB Assembly and created our own factory in Baoan district, Shenzhen. more

BGA Assembly

BGA (Ball Grid Array) assembly with X ray inspection.

Kingsheng has started build (Ball Grid Array) BGA assembly service experience since Year 2005 to present time. Over these many years experience with X Ray inspection machine, right assembly procedure, we are very confident to say that we know, and we can build a high quality, good yield rate BGA board.

Ball grid array(BGA) packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. BGA unfilled die attachment technology will result in a smaller profile, lighter weight, thinner thickness, less interference, minimal signal delay, optimal electrical performance and improve its thermal property greatly. Therefore, BGA has been commonly used for its better assembly capability and high reliability.