Assembly Methods Of SMT Chip Processing

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In traditional Through-Hole Technology (THT) printed circuit boards, components and solder joints are located on both sides of the board. In contrast, Surface-Mount Technology (SMT) printed circuit boards have both solder joints and components on the same side, resulting in fewer and smaller holes, which significantly improves the assembly density of the circuit board. Below, we will discuss the assembly methods of SMT chip processing, organized by Changkeshun SMT patch processing factory.

1. SMT Single-Side Mixed Assembly Method

The first type is single-sided hybrid assembly. This method involves Surface Mount Components (SMC) and Surface Mount Devices (SMD) distributed alongside through-hole cartridge components (17HC) on different sides of the PCB, but with only one weld surface. This assembly method typically uses a single-sided PCB and a wave soldering process (often double wave soldering). There are two specific assembly procedures within this method:

- First Paste Method: In this assembly approach, SMC/SMD components are first attached to the B side of the PCB (the solder side), followed by the insertion of the THT components on the A side.

- Post-Paste Method: Here, THT components are inserted first on the A side of the PCB, and afterward, SMD components are mounted on the B side.

Assembly Methods Of SMT Chip Processing

2. SMT Double-Sided Hybrid Assembly Method

The second type is double-sided hybrid assembly, where SMC/SMD and THT components can be distributed on the same or both sides of the PCB. This method employs double-sided PCBs and can utilize either double wave soldering or reflow welding. In this type, the choice between the first paste and post-paste methods is usually made based on the type of SMC/SMD and the size of the PCB. Typically, the first paste method is more common. There are two typical assembly methods for this type:

- SMC/SMD and other THT components are placed on the same side of the PCB.

- SMC/SMD and THT components are placed on opposite sides of the PCB, where surface-mounted integrated chips (SMIC) and THT are on side A, and SMC and small outline transistors (SOT) are on side B.

This assembly method results in high assembly density due to the placement of SMC/SMD components on one or both sides of the PCB, along with the inclusion of lead components that are challenging to assemble on the surface.

In summary, the assembly method of SMT chip processing and its workflow are primarily influenced by the type of surface mount components (SMA), the types of components used, and the assembly equipment conditions. Generally, SMAs can be classified into three categories: single-side mixed, double-side mixed, and full-surface assembly, resulting in a total of six distinct assembly methods. Each type of SMA uses different assembly methods, and even the same type can have various approaches.

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– Experienced and skilled team

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– Strict quality control

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