PCBA manufacturing is quite a complicated and precise process, it contains PCB bare board manufacturing process, component inspection, SMT assembly, DIP, and PCBA testing. Among them, PCBA testing is the most critical quality control part of the entire PCBA manufacturing process. The testing determines the final performance of the product.
Using specialized 3D SPI equipment to inspect the amount and placement of solder paste on board before the reflow process. It uses lasers and cameras to scan the surface of the PCBA and create a 3D image of the solder paste deposits. The software then analyzes the image and compares it to the design specifications to determine if the solder paste is within the acceptable range.
3D AOI stands are a type of inspection used in the manufacturing process to inspect components conditions from different angles after mounting. The software then analyzes these images to detect any defects such as components missing, incorrect placement, soldering defects, or other issues.
Automatic X-ray Inspection is used to inspect hidden solder joints, BGA(ball-grid arrays), wire bonding, and other internal components that are not visible through visual inspection. AXI also can help detect hidden defects early in the manufacturing process, reducing the risk of costly rework or product failures down the line. It’s particularly useful for complex and dense board assemblies that are difficult to inspect manually or with other inspection techniques.
Ultrasonic cleaning is used to remove contaminants from the board. It involves immersing the board in a cleaning solution and using high-frequency sound waves to agitate the solution. This agitation creates tiny bubbles that help loosen and remove dirt, grease, flux residue, and other contaminants from the surface of the board.
The flying probe test is used in the manufacturing process to test the board. It involves using specialized equipment that automatically probes the board with small metal pins to test the connectivity and functionality of the board's components. The flying probe test machine uses two or more robotic arms, each with a set of probes at their end, that can move independently around the surface of the board. The probes touch various points on the board, sending signals to the machine to test the connectivity and functionality of the components.
ICT stands are used in the manufacturing process to test boards. It involves using specialized equipment to check the electrical connectivity(measure resistance, capacitance, inductance, capacitance, diode, field effect tube, integrated block, welding joints, open or short circuit faults) and functionality of individual components on the board. It is particularly effective for detecting open circuits, short circuits, and component damages, with accurate fault location and convenient maintenance.
FCT is used in the manufacturing process to test boards by checking their functionality under simulated real-world conditions. The machine applies input signals to the PCBA and monitors the output signals to ensure that the device performs as expected. Functional test items mainly include voltage, current, power, power factor, frequency, duty cycle, brightness and color, character recognition, voice recognition, temperature measurement, pressure measurement, motion control, FLASH, EEPROM burning, etc.
The aging test involves subjecting the electronic device or component to a set of environmental conditions and operational stresses beyond what it would normally experience during normal use. These conditions can include high temperatures, humidity, vibration, shock, and other factors that may cause the device to fail.
Kingsheng can also perform Reliability test, including Humidity, Extreme Temperature test(High and low temperature cycle test), Dropping, Vibration Test Or others.
We support you outsourcing test if you have test requirement which Kingsheng can not conduct. We also assist you to gain testing certificates from the third-party testing institution.