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The reliability of BGA Electronic packaging technology needs to be evaluated before applying it to the complete model. This evaluation should be based on the environmental characteristics of the application and the reliability requirements of the complete machine.
The evaluation process should be carried out from two dimensions, the device package itself, and the device reliability after assembly. The evaluation of the device package itself should focus on package design, structure, material, and process, and computer simulation analysis. On the other hand, the package reliability evaluation after the device is assembled should focus on environmental and mechanical stresses and computer simulation analysis to evaluate the reliability of the whole machine.
BGA Electronic Packaging Technology
Different packages have different requirements for the electrical assembly process. PCBA processing and manufacturing companies need to analyze the assembly process's adaptability according to the package structure's characteristics.
The package reliability evaluation process is based on demand analysis, which is divided into two aspects: the device structure itself and the application environment. The evaluation process involves computer simulation analysis and physical analysis. The simulation analysis starts with signal integrity analysis, followed by the analysis of mechanical and thermal characteristics. The physical analysis process should be carried out for packaged products, and representative samples should be selected.
The reliability evaluation plan for BGA Electronic packaging devices should consider the solder balls, bonding density, bonding wire length, and soldering of chip bumps. The integrity of multiple channels, power, and ground signals of BGA packaged devices needs special consideration, so signal integrity analysis is an important part of BGA Electronic packaging simulation analysis.
Why Choose China PCBA Supplier KSPCBA as Your BGA Electronic Packaging Technology Manufacturer?
– Experienced and skilled team
– State-of-the-art equipment
– Strict quality control
– Excellent customer service
– Competitive price
Please send Email to kspcba@c-alley.com or call us through +86 13828766801 Or submit your inquiry by online form. Please fill out below form and attach your manufacturing files( PCB Gerber files and BOM List) if need quotation. We will contact you shortly.
+86 13828766801
kspcba@c-alley.com
https://www.kingshengpcba.com/
2/F, Building 6, Tangtou 3rd Industrial Zone, Tangtou Community, Shiyan Town, Baoan District, Shenzhen, China, 518108
We would also like to thank our customers for their trust and support. The company's outstanding achievements are mainly due to the loyalty of our customers, which also encourages and spurs our company to forge ahead.
