Composition of Aluminum Substrate

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The circuit layer, typically made of electrolytic copper foil, is etched to create a printed circuit for device assembly and connection. In comparison to traditional FR-4, an aluminum substrate of the same thickness and line width can support higher currents.

Composition of Aluminum Substrate

The insulating layer is a crucial technology in the aluminum substrate, serving bonding, insulation, and heat conduction purposes. It acts as the primary thermal barrier in power module structures. Enhanced thermal conductivity in the insulating layer facilitates heat dissipation during device operation, effectively reducing operating temperatures, increasing module power load, reducing volume, extending life, and enhancing power output.

The choice of metal for the insulated metal substrate depends on considering the thermal expansion coefficient, thermal conductivity, strength, hardness, weight, surface condition, and cost.

Typically, aluminum plates are the ideal choice based on cost and technical performance. Aluminum plate options include 6061, 5052, 1060, etc. Alternatively, for specific requirements such as higher thermal conductivity, mechanical properties, and electrical properties, copper plates, stainless steel plates, iron plates, and silicon steel plates can be used.

KSPCBA is eager to serve as your business partner striving to become the leading prototyping PCB manufacturer globally. With over a decade of industry experience, our commitment includes meeting diverse industry requirements for quality, delivery, cost-effectiveness, and other demanding needs. As one of the most experienced PCB manufacturers and SMT assemblers in China, we aim to be your trusted partner, making your PCB needs stress-free.

Why Choose China PCBA Supplier KSPCBA as Your Composition of Aluminum Substrate Manufacturer?

– Experienced and skilled team

– State-of-the-art equipment

– Strict quality control

– Excellent customer service

– Competitive price