Factors of poor PCB surface quality in PCBA processing

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The support height (the space between the PCB and the ground clearance) is likewise getting smaller and smaller as the density and size of PCBA components increase. Additionally, the PCBA is affected by environmental factors. The impact is growing and increasing the demands placed on the PCBA reliability of electrical equipment. The following KSPCBA briefly introduces the factors that cause poor PCB surface quality during the production and PCBA processing process.

1. When processing thin PCB substrates (usually below 0.8mm), the rigidity of the substrate can be poor, making it unsuitable to brush with a brushing machine. This can result in difficulty removing the protective layer that prevents oxidation of the copper foil on the board surface. Although this layer is thin and easy to remove with a brush, it can be difficult to treat chemically.

2. During machining (such as drilling, lamination, milling, etc.) of the PCB surface, the surface treatment can be poor due to oil or other liquid contaminated with dust.

3. Poor sinking copper brushing can occur due to excessive pressure from the sinking copper front grinding plate, causing hole deformation, brushing the hole copper foil rounded corners, and even substrate leakage. This can result in sinking copper electroplating, spraying tin soldering, and blistering at the orifice. Therefore, it is important to strengthen the control of the brushing process and adjust the brushing process parameters to appropriate values through wear scar tests and water film tests.

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Why Choose China PCBA Supplier KSPCBA as Your PCBA processing Manufacturer?

– Experienced and skilled team

– State-of-the-art equipment

– Strict quality control

– Excellent customer service

– Competitive price