Important Features of the High-Reliability PCB

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When it comes to PCBs, their reliable performance is critical both during the manufacturing assembly process and in actual use. Defects during assembly may be introduced to the final product through PCBs, and failures may occur during use, resulting in claims. From this point of view, it is safe to say that the cost of a high-quality PCB is negligible. In all segments of the market, particularly in the production of key applications, the consequences of such failures can be disastrous.

When comparing PCB prices, it is important to keep these aspects in mind. Although the initial cost of a reliable, guaranteed, and long-life product may be high, it provides good value in the long run. Here are 14 of the most important features of highly reliable PCB boards:

1. Hole wall with a copper thickness of 25um
Benefits:
- Improved reliability, including better resistance to expansion in the Z-axis.
Risk:
- Electrical connectivity problems during hole blowing or degassing, assembly (internal separation, hole wall fracture), or failure may occur during actual use under load conditions. The standard adopted by most factories requires less than 20% copper plating.

2. No welding repair or open circuit repair
Benefits:
- Perfect circuitry provides reliability and safety, with no maintenance and no risk.
Risk:
- Improper repair could break the circuit board. Even if repaired properly, there is a risk of failure under load conditions (vibration, etc.), which may lead to failure during actual use.

3. IPC specification cleanliness requirements exceeded
Benefit:
- Improved PCB cleanliness enhances reliability.
Risk:
- Residue and solder accumulation on the board can pose risks to the SM layer, and ion residue can lead to corrosion and pollution risks on the welding surface. This may cause reliability problems (bad solder joint/electrical fault), and ultimately increase the probability of actual faults.

4. Strict control of the service life of each surface finish
Benefit:
- Solderability, reliability, and reduced risk of tidal intrusion.
Risk:
- The metallographic change of the surface finish of the old board can result in poor solderability, and moisture intrusion can lead to delamination, inner layer, and hole wall separation (circuit breaker) during the assembly process and/or actual use.

5. Use of internationally renowned substrate
Benefit:
- Improved reliability and known performance.
Risk:
- Poor mechanical performance may prevent the board from performing as desired under assembly conditions. For example, higher expansion performance can lead to delamination, open circuit, and warpage problems. Weaker electrical characteristics lead to poor impedance performance.

6. Copper-clad plate tolerance meets IPC4101ClassB/L requirements
Benefit:
- Strict control of the thickness of the dielectric layer reduces the expected deviation of electrical performance.
Risk:
- Electrical performance may not meet the specified requirements, and the output and performance of the same components may vary greatly.

Important Features of the High-Reliability PCB

7. Define the solder material to meet the requirements of the IPC-SM-840 Class T.
Benefit:
Using "excellent" ink ensures the safety of ink and meets the UL standard, guaranteeing that the solder resists ink.
Risk:
Poor quality ink can cause adhesion, flux resistance, and hardness issues. These problems lead to the separation of the solder layer from the circuit board, eventually leading to copper circuit corrosion. Poor insulation performance can cause a short circuit by unexpected conduction/arc.

8. Define tolerances of the profile, hole, and other mechanical features.
Benefit:
Strict tolerance control can improve the dimensional quality of products, enhancing fit, profile, and function.
Risk:
Assembly problems, such as alignment/fit, can arise if tolerances are not controlled strictly. Additionally, size deviations can cause issues with the base.

9. The thickness of the solder mask requirements, although IPC has no relevant provisions.
Benefit:
Increasing the thickness of the solder mask improves electrical insulation characteristics, reduces the risk of spalling or loss of adhesion, and strengthens the ability to fight mechanical impact, regardless of where the mechanical impact occurs.
Risk:
A thin solder layer can lead to adhesion, flux resistance, and hardness problems. These problems lead to the separation of the solder layer from the circuit board, eventually leading to copper circuit corrosion. Poor insulation performance can cause a short circuit by unexpected conduction/arc.

10. Define the appearance and repair requirements, although IPC is not defined.
Benefit:
Defining appearance and repair requirements ensures safety in the manufacturing process.
Risk:
Scratches, small damage, and repair can cause the circuit board to be functional but not aesthetically presentable.

11. The hole depth requirement.
Benefit:
High-quality plug holes reduce the risk of failure in the assembly process.
Risk:
Chemical residue in the process of ENIG remains in the plug-failure hole, resulting in solderability problems. The hole may also have a solder ball, which can cause a short circuit during assembly or actual use.

12. Specify the brand and model of the peelable blue mask.
Benefit:
Specifying the brand and model of the peelable blue mask can avoid using "local" or cheap brands.
Risk:
Inferior cheap brands can be foamed, melted, broken, or solidified like concrete, so the Peelable blue mask cannot peel off/not work during assembly.

13. Perform specific approval and single order procedures for each purchase order.
Benefit:
Executing the program ensures that all specifications are confirmed.
Risk:
If the product specifications are not carefully recognized, the resulting deviation may be found at the end of the assembly or final product, which could be too late to fix.

14. Do not accept scrap board.
Benefit:
Rejecting defective panels helps customers improve efficiency.
Risk:
Special assembly procedures are required for defective panels, which could result in assembling broken plates and waste parts if they are not indicated on the scrap board (x-out) or are not isolated from the cover plate.

Why Choose China PCBA Supplier KSPCBA as Your PCB Manufacturer?

– Experienced and skilled team

– State-of-the-art equipment

– Strict quality control

– Excellent customer service

– Competitive price