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Aluminum substrate is a type of copper clad laminate that utilizes aluminum as the base material, providing excellent heat dissipation. We commonly use aluminum substrates for circuit boards that require effective heat dissipation. In the application of LED lamps, the large heat generated by LEDs can cause brightness decay and even chip burnout if not dissipated promptly. Aluminum, being a metal with good thermal conductivity, allows for quick heat dissipation when LED light beads are installed on the aluminum substrate. Additionally, the aluminum substrate is designed with an insulating layer to prevent electrical conduction, which would hinder the design of circuits.
This technology is employed in the high-performance aluminum substrate's thermal insulation layer, resulting in extremely efficient thermal conductivity and high-strength electrical insulation. The metal base, which requires high thermal conductivity, serves as the supporting component of the aluminum substrate. Generally, an aluminum plate is used, and a copper plate can also be utilized for even better thermal conductivity, making it suitable for conventional machining methods such as drilling, punching, and cutting.
Compared with other materials, PCBs offer incomparable advantages. They are suitable for the surface mounting technology (SMT) of power components, eliminating the need for a radiator, reducing the volume, and providing excellent heat dissipation, as well as good insulation and mechanical properties.
Introduction To LED Aluminum Substrate
Single-sided aluminum substrates typically consist of three layers: a circuit layer (copper foil), an insulation layer, and an aluminum metal base. An insulating layer between the circuit layer and the aluminum base prevents short circuits. Double-layer high-end aluminum substrates have a circuit layer on both sides with aluminum in the middle. Multilayer aluminum substrates are rare.
LED lamps generally use single-sided aluminum substrates where the circuit layer is affixed with LEDs. The aluminum substrate on the back allows for efficient heat dissipation by making good contact with the radiator.
The insulation layer in the aluminum substrate is crucial, serving as the core technology of the aluminum substrate. It should not only adhere to the copper foil, but also have excellent thermal conductivity, as it acts as the primary thermal conductivity barrier. If the heat from the copper foil cannot be quickly transferred to the aluminum substrate, the aluminum substrate will lose its significance.
Characteristics of LED aluminum substrate:
1. Utilizes surface mount technology (SMT).
2. Effectively manages thermal diffusion in the circuit design.
3. Reduces product operating temperature, improves power density and reliability, and extends product lifespan.
4. Reduces product volume, hardware, and assembly costs.
5. Replaces fragile ceramic substrates for improved mechanical durability.
Application of LED aluminum substrate:
Intended for use in Power Hybrid IC (HIC).
1. Audio equipment: input and output amplifiers, balance amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.
2. Power supply equipment: switch regulator, DC/AC converter, SW regulator, etc.
3. Communication electronic equipment: high frequency amplifier, filter electric appliance, sending circuit.
4. Office automation equipment: motor driver, etc.
5. Automobile: electronic regulator, igniter, power controller, etc.
6. Computer: CPU board, floppy disk drive, power supply device, etc.
7. Power module: inverter, solid relay, rectifier bridge, etc.
Why Choose China PCBA Supplier KSPCBA as Your LED Aluminum Substrate Manufacturer?
– Experienced and skilled team
– State-of-the-art equipment
– Strict quality control
– Excellent customer service
– Competitive price
Please send Email to kspcba@c-alley.com or call us through +86 13828766801 Or submit your inquiry by online form. Please fill out below form and attach your manufacturing files( PCB Gerber files and BOM List) if need quotation. We will contact you shortly.