LED Die Substrate - PCB Supplier

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LED die substrates are used as a medium for heat dissipation between the LED die and the system circuit board. They are combined with the LED die through processes such as wire bonding, eutectic, or flip chip. Currently, the market mainly offers ceramic substrates for heat dissipation, which can be divided into three types: thick-film ceramic substrates, low-temperature co-fired multilayer ceramics, and thin-film ceramic substrates. Thick-film or low-temperature co-fired ceramic substrates are commonly used for high-power LED components, and they are combined with the LED die using gold wires.

LED Die Substrate

The efficacy of heat dissipation along the electrode contacts is limited by the gold wire connection mentioned earlier, prompting major manufacturers to seek solutions. One approach is to find a substrate material with a higher heat dissipation coefficient to replace alumina. Silicon substrates, silicon carbide substrates, anodized aluminum substrates, and aluminum nitride substrates are being explored, among which aluminum nitride is the more mature and generally accepted option for heat dissipation substrate due to its characteristics.

One limitation is that the traditional thick film process is not suitable for aluminum nitride substrates, as the material must be heat-treated in the atmosphere at 850°C after the silver paste is printed, leading to material reliability issues. Therefore, aluminum nitride substrate circuits need to be prepared by thin film manufacturing processes. Utilizing the thin-film process for aluminum nitride substrates accelerates heat efficiency from the LED die to the system circuit board and reduces the burden of heat from the LED die to the system circuit board through the metal wire, resulting in effective heat dissipation.

Why Choose China PCBA Supplier KSPCBA as Your LED Die Substrate Manufacturer?

– Experienced and skilled team

– State-of-the-art equipment

– Strict quality control

– Excellent customer service

– Competitive price