Methods for PCB Heat Dissipation

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When it comes to circuit board heat dissipation, I am reminded of the mobile phones that we often use in our daily lives. Almost everyone has a mobile phone, which heats up during use. This is caused by the internal components of the mobile phone. If these components are not properly designed to handle heat, they will result in device overheating, which can cause harm to the user and damage the hardware. Similarly, the components on PCB boards have different temperature resistance effects due to their various sizes and shapes. For example, the working temperature of common IC materials is as high as 100 degrees Celsius or higher.

All electronic devices have different levels of power consumption, and the heating intensity varies with the size of the power consumption. If heat dissipation measures are not used, the equipment we use will continue to heat up, leading to system disorder and reduced reliability. The consequences of this can be unimaginable. Therefore, the heat dissipation of the circuit board is particularly important.

The direct cause of PCB heating is that the power carrying capacity of the component itself is too low. If the power carrying capacity is small, the component will generate heat, which will be conducted on the circuit board. Another cause of PCB heating is that the high-current circuit design on the circuit board is not reasonable.

To address this issue, practical methods for PCB heat dissipation include:

1. Placing components in a good heat dissipation environment: If the circuit board is too close to heating or radiator components, it can cause the heat to be unable to dissipate, leading to heat accumulation and circuit board overheating. To prevent this, components should be reasonably placed to allow for airflow and heat dissipation. Large components should not be placed in the position of the air inlet, but instead in a good heat dissipation location.

Methods for PCB Heat Dissipation

2. Placing temperature-sensitive devices in a low-temperature area: Temperature-sensitive devices, such as thermistors, should be placed in a low-temperature area as they are sensitive to temperature changes.

3. Distributing components evenly: For components with serious heat generation, it's best to avoid placing them together and distribute them as evenly as possible across the circuit board. If there is a fan system for heat dissipation, the heat should be concentrated and moved to the other side of all components, while the left and right components are best arranged in a vertical (horizontal) way to facilitate heat dissipation.

4. Placing high-power devices on the edge of the circuit board: High-power devices, such as transistors and amplifiers, can be placed on the edge of the circuit board to reduce the effect of heat radiation on surrounding components.

5. Avoiding the concentration of hot spots: Power should be distributed evenly across the PCB board to avoid the concentration of hot spots on the PCB components.

6. Adding heat sinks: For components with serious heat generation, such as switch tubes, heat sinks can be added to help dissipate heat. High thermal conductivity insulating silicone material heat dissipation paste can be added at the same time to improve heat dissipation performance.

To ensure the normal operation of the entire circuit, designers should also pay attention to areas with too high power density and perform thermal efficiency analysis. Some professional PCB design software includes a thermal efficiency index analysis software module, which can help designers optimize circuit design and avoid the annoyance of circuit board heating.

Why Choose China PCBA Supplier KSPCBA as Your Methods for PCB Heat Dissipation Manufacturer?

– Experienced and skilled team

– State-of-the-art equipment

– Strict quality control

– Excellent customer service

– Competitive price