Precautions For Using Automatic Dispensing on PCB

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The automatic dispensing machine is designed for use with PCB circuit boards and functions as a desktop packaging device. Like all packaging equipment, PCB automatic dispensing machines are automated, utilizing precise fluid control technology. One of the main advantages of PCB packaging equipment is its ability to perform continuous and uninterrupted point filling operations on PCB boards.

When using an automatic dispensing machine, several important factors must be considered. First, the viscosity of the glue is crucial; insufficient viscosity can weaken the bond strength of the package, while excessive glue can lead to issues such as dripping. Additionally, removing glue bubbles is essential before the packaging process, requiring collaboration between operators and the technology of the packaging equipment. Fortunately, current fully automatic dispensing machines on the market effectively address this issue.

PCB dispensing is utilized across a wide range of automatic packaging equipment, with desktop automatic dispensing machines being the most commonly used. The PCB dispensing machine has gained popularity in the desktop packaging equipment market due to its stable control system and accurate positioning capabilities.

Precautions For Using Automatic Dispensing on PCB

As the economy develops and technological innovations advance, the application field for automatic dispensing machines has further expanded. The evolution of automatic dispensing machine technology benefits both packaging equipment manufacturers and application enterprises alike, creating a win-win situation. The use of automatic dispensing machines has significantly enhanced production efficiency and improved product quality compared to manual dispensing methods. For packaging manufacturers, the needs of various application industries drive technological innovation.

Regarding the challenges of plugging in electronic patch nozzles during SMT (Surface Mount Technology) patch processing, SMT offset adhesive products can effectively meet customer needs for SMT production, providing high bond strength to chips. These adhesives also feature excellent heat resistance, making them suitable for reflow soldering and wave soldering processes, along with high wet strength and good storage stability. We offer our customers products compatible with various sizing processes, including manual, semi-automatic, automatic scraping, and thick mesh scraping processes.

During the dispensing of red glue, the glue nozzle can sometimes become blocked. Potential causes for this include incompatible glue cross-contamination, incomplete cleaning of the pinhole, residual glue inside the pinhole that has undergone anaerobic curing, and inconsistent patch particle size.

To resolve these issues, one can replace the rubber nozzle or clean the needle hole and sealing ring of the rubber nozzle. It's essential to clean the nozzle carefully, avoiding the introduction of solidified residual glue into it (such as at the start and end of each glue tube). Additionally, avoid using brass or copper dispensing tips, as acrylic adhesive patches possess anaerobic curing properties. Lastly, choose patches with a uniform particle size to minimize clogging.

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– Experienced and skilled team

– State-of-the-art equipment

– Strict quality control

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– Competitive price