Problems And Solutions During PCBA Processing

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SMT patch processing is a crucial technology in the SMT process. However, the speed of patch processing often limits the production line's capacity.

To set up an SMT placement processing production line, there must be at least one high-speed placement machine for placing regular-sized components and a multi-function placement machine for placing special-sized components. Common issues are often encountered during the process of SMT patch processing.

1. Poor wetting during PCBA processing

Phenomenon: During the soldering process, the substrate solder area and metal do not react after the solder is infiltrated, resulting in less soldering or missing soldering.

Reason analysis:

(1) During wave soldering, gas on the surface of the substrate can lead to poor wetting.

(2) When the residual metal in the solder exceeds 0.005%, the flux activity decreases, leading to poor wetting.

(3) Contamination of the surface of the welding area, staining with flux, or metal compounds generated on the surface of the chip component can also cause poor wetting. For example, sulfide on the surface of silver and oxide on the tin surface can result in poor wetting.

Solution:

(1) Implement the corresponding welding process strictly.

(2) Clean the surface of PCB circuit boards and components.

(3) Choose a suitable solder and set reasonable soldering temperature and time.

Problems And Solutions During PCBA Processing

2. PCB Tombstone

Phenomenon: One end of the component does not touch the pad and stands upright, or the touched pad is upright.

Reason analysis:

(1) It is related to the wettability of solder paste.

(2) The shape of electronic components makes it easy to produce tombstones.

(3) The temperature rises too fast during reflow soldering, and the heating direction is uneven.

(4) The wrong solder paste is selected, there is no preheating before soldering, and the size of the soldering area needs to be selected correctly.

Solutions for PCBA processing:

1. Set the printing thickness of the solder reasonably.

2. Formulate the temperature rise of the reflow soldering zone reasonably.

3. Store and retrieve electronic components as required.

4. Reduce the surface tension of the component ends when the solder melts.

5. Preheat the PCB circuit board to ensure uniform heating during soldering.

Why Choose China PCBA Supplier KSPCBA as Your PCBA Processing Manufacturer?

– Experienced and skilled team

– State-of-the-art equipment

– Strict quality control

– Excellent customer service

– Competitive price