SMT Production Efficiency and Processing Precautions

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The efficiency of SMT (Surface Mount Technology) patch processing is influenced by various factors. For instance, when the overall production volume remains constant and there are numerous SMT patch production lines, the production speed can be increased. However, this also leads to higher operating costs. In the fiercely competitive electronics industry, it is crucial to enhance the placement rate to satisfy customers. The following briefly outlines the factors and improvement measures for the SMT placement rate:

The SMT production line mainly consists of screen printing machines, high-speed placement machines, multi-function placement machines, reflow soldering machines, and AOI (Automated Optical Inspection) automatic detectors. If two placement machines complete a placement process, the time (referred to as placement time) may not be equal. When the time is not equal, it affects the patch rate, and specific methods can be employed to address this:

1. Balanced load distribution: Allocating the number of SMT components appropriately to achieve a balanced load distribution, ensuring the same placement time for two SMT placement machines.

SMT Production Efficiency and Processing Precautions

2. SMT placement machine itself: While the SMT placement machine has a maximum placement speed value, attaining this value is generally challenging. This is related to the structure of the SMT placement machine, such as the X/Y structure. Taking measures to enable the placement head to pick up components simultaneously as much as possible can help. Additionally, arranging the same type of components together in the placement program can reduce the number of nozzle changes and save mounting time.

The SMT production line comprises various equipment. If any equipment processes slowly, it will delay the placement time and affect the entire processing process. Improvements are not solely based on theory but also the extensive experience of on-site operators.

Process requirements and precautions for SMT patch processing:

1. Solder paste printing: FPC (Flexible Printed Circuit) is positioned based on its appearance on a special pallet for printing. Small semi-automatic printing machines are generally used for printing, although manual printing can be utilized as well. However, the quality of manual printing is inferior to that of semi-automatic printing.

2. Placement during SMT processing: Manual placement is typically used, and individual components with higher position accuracy can also be placed by a manual placement machine.

3. PCB welding: The reflow welding process is commonly used, although spot welding can be employed in special cases.

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