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Although a perfect design solution is the best way to avoid problems, it can still be a waste of time and money while only treating the symptoms. For instance, if issues are discovered during the EMC testing phase, it can lead to significant costs, and even the original design plan may require adjustments and recreation, which can take several months.
The layout is the first problem that designers must face. It depends on a part of the drawing, and some devices need to be set together based on logical considerations. However, designers must note that temperature-sensitive components such as sensors should be placed separately from heat-generating components such as the power converter. In designs with multiple power settings, the 12- and 15-volt power converters can be located in different locations on the board because the heat and electronic noise they generate can affect the reliability and performance of other components and boards.
The above components also impact the electromagnetic performance of the circuit design. This is crucial not only for the performance and energy consumption of the circuit board but also has a significant impact on the economics of the circuit board. Therefore, all circuit board equipment sold in Europe must obtain the CE mark to prove that it will not interfere with other systems. However, this is usually only in terms of power supply, and there are many devices that emit noise, such as DC-DC converters and high-speed data converters. Due to circuit board design flaws, these noises can be captured by the channel and radiated as small antennas, resulting in noise and frequency anomalies.
Far-field electromagnetic interference (EMI) problems can be solved by installing filters at noise points or by shielding the signal with a metal case. However, designers should also pay sufficient attention to equipment that can release electromagnetic interference (EMI) on the circuit board. By doing so, they can make the circuit board use a cheaper housing, effectively reducing the cost of the entire system.
Electromagnetic interference (EMI) is indeed a factor that must be taken seriously during the circuit board design process. Electromagnetic crosstalk can be coupled with the channel, thereby disrupting the signal into noise and affecting the overall performance of the circuit board. If the coupling noise is too high, the signal may be entirely covered. Therefore, adding a more expensive signal amplifier may be necessary to return to normal. However, if designers can take into account the layout of the signal line at the beginning of the circuit board design, the above problems can be avoided. Since the design of the circuit board varies depending on different equipment, use locations, heat dissipation requirements, and electromagnetic interference (EMI) conditions, the design template will be deployed.
Capacitance is also an important issue in circuit board design as it can affect the speed of signal propagation and increase power consumption. The channel will couple with the next line or cross the two circuit layers vertically, creating a capacitor inadvertently. This problem can be relatively easy to solve by reducing the length of the parallel lines, adding kinks to one of the lines, and cutting off the coupling. However, this requires engineering designers to fully consider the principles of production design to ensure that the design scheme is easy to manufacture and avoid any noise radiation due to the excessive bending angle of the line. The distance between the lines may also be too close, resulting in a short circuit between the lines, especially at the bends of the lines. Metal whiskers will appear over time. Design rule testing can often indicate areas where the risk of the circuit is higher than normal.
This problem is particularly prominent in the design of ground planes. A metal circuit layer may form a coupling with all the lines above and below it. Although the metal layer effectively blocks noise, it also generates associated capacitance, affecting the operating speed of the circuit and increasing power consumption.
For the design of multi-layer circuit boards, the design of via holes between different circuit board layers is probably the most controversial issue. Through-hole design can create many problems for the manufacture of circuit boards. The through holes between the circuit board layers can affect the signal performance and reduce the reliability of the circuit board design. Therefore, sufficient attention must be paid to it.
The core of PCB design and solutions
During the design process of a printed circuit board (PCB), there are different methods that can be used to solve various issues. One of them is adjusting the design scheme itself, such as modifying the circuit layout to minimize noise. Additionally, there are methods for the layout of printed circuit boards that can be automatically installed by the layout tool, but it's helpful to manually adjust the automatic layout to improve the quality of the board design. By doing this, design rule detection will utilize technical documents to ensure that the design of the circuit board meets the requirements of the circuit board manufacturer.
Separating the different circuit board layers can decrease the associated capacitance, but this will increase the number of layers on the circuit board, which will also raise the cost and lead to more problems with through-holes. However, by using orthogonal grid power supply systems and grounding circuit designs, it's possible to increase the physical size of the circuit board. This can effectively function as a ground plane in a double-layer circuit board, reducing the complexity of the capacitance and circuit board manufacturing.
Design tools, including DesignSpark PCB, can help engineering designers solve many problems at the beginning of the design. However, engineering designers still need to have a thorough understanding of the design requirements for printed circuit boards (PCBs). For example, if an editor of a printed circuit board (PCB) needs to know the layer number of the circuit board at the beginning of the design, such as a two-layer circuit board, it needs a ground plane and a power supply. The layer consists of two mutually independent layers.
The usefulness of automatic component placement technology can help designers spend more time designing the device's layout area. For example, if the power supply equipment is too close to a sensitive signal line or a high-temperature area, there will be many problems. In the same way, signal lines can also be automatically routed while avoiding most problems. However, analyzing and manually manipulating high-risk areas will greatly improve the quality of printed circuit board (PCB) designs, increase revenue, and reduce overall costs.
Design rule detection is also a very powerful tool that can detect the line and ensure that the distance between the lines is not too close, which can cause a short circuit. However, the overall design still has high economic value. The design planning inspection tool can also be used to detect and adjust the power and ground planes to avoid creating large areas of associated capacitance.
The above tools will also be of great help to Gerber and Excellon, which will help them in the production of final design products, such as circuit and board printing, and through-hole drilling. As a result, the technical documents are closely linked with the circuit board manufacturers.
In conclusion, many issues need to be considered during the design process of a printed circuit board (PCB), and tools like DesignSparkPCB can effectively handle most of them. By adopting some best-practice guidelines, engineering designers can effectively reduce costs, increase the reliability of the board, meet the requirements of the system specifications, bend the system certification at a lower cost, and avoid more problems.
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