The Links In One-stop PCBA Assembly

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What are the links in one-stop PCBA assembly and processing?

PCBA (Printed Circuit Board Assembly) is a complex process that involves several steps including PCB circuit board manufacturing, component procurement and inspection, SMT (Surface Mount Technology) chip processing, plug-in processing, program firing, testing, and aging. The quality of each step must be controlled to produce high-quality products.

1. PCB circuit board manufacturing

Upon receiving the PCBA order, the Gerber file is analyzed to ensure the PCB hole spacing is suitable and the board can bear the load without bending or breaking. Furthermore, the wiring considers crucial factors such as high-frequency signal interference and impedance.

2. Procurement and inspection of components

To procure components, it is necessary to strictly control the channels and acquire them from large traders and original factories, avoiding second-hand and fake materials. An incoming materials inspection post is established to strictly inspect the components for faults. The following aspects are checked:

- PCB: reflow soldering furnace temperature, no flying leads, whether the vias are blocked or leaking ink, and whether the board surface is bent.

- IC: silk screen consistency with the BOM, and maintenance at a constant temperature and humidity.

- Other common materials: silkscreen, appearance, power-on measurement, etc.

Inspection items are carried out according to the random inspection method, and the ratio is generally 1-3%.

The Links In One-stop PCBA Assembly

3. SMT patch processing

Solder paste printing and reflow oven temperature control are key points, and it is essential to use laser stencils of good quality that meet process requirements. According to the requirements of PCB, some steel mesh holes need to be enlarged or reduced, or U-shaped holes are used to make steel mesh according to process requirements. The furnace temperature and speed control of the reflow soldering are critical to the solder paste infiltration and soldering reliability. It can be controlled by the normal SOP (Standard Operating Procedure) operation guidelines. In addition, AOI (Automated Optical Inspection) testing needs to be strictly implemented to minimize defects caused by human factors.

4. DIP plug-in processing

The mold design for wave soldering is a key point in the plug-in process. Engineers must continue to practice and summarize experience to maximize the probability of good products after the furnace.

5. Program firing

Customers can be suggested to set up some test points on the PCB in the previous DFM (Design for Manufacturing) report. The purpose is to test the PCB and PCBA circuit continuity after soldering all components. If possible, the customer can provide a program to burn into the main control IC through the burner. This can more intuitively test the functional changes brought about by various touch actions and test the function of the entire PCBA completeness.

6. PCBA test

For orders with PCBA test requirements, the main test content includes ICT (In-Circuit Test), FCT (Functional Circuit Test), aging test, temperature and humidity test, drop test, etc. The tests can be performed according to the customer's test plan and summarized report data.

Why Choose China PCBA Supplier KSPCBA as Your The Links In One-stop PCBA Assembly Manufacturer?

– Experienced and skilled team

– State-of-the-art equipment

– Strict quality control

– Excellent customer service

– Competitive price