Three cases of disassembling SMT patch processing components

1. Characteristics of its own

The disassembly method of SMT patch components depends on the characteristics of the component itself. For components with fewer pins, such as resistors, capacitors, diodes, and triodes, first weld one of the pads to the PCB board, then use the tweezers in the left hand to clamp the element to the mounting position and close to the board, then use the soldering iron in the right hand to weld the pins to the tinned pad. The left tweezers can be loosened and the remaining feet can be welded with tin wire. If you want to disassemble these parts, it is easy to heat both ends of the parts with a soldering iron. Once the tin has melted, gently lift the piece to remove it.

2. Similar method

A similar approach is used for SMT patch components with multiple pins and wide spacing. First, the pad is tinned, then one foot is welded with a tweezer holding the piece in the left hand, then the other foot is welded with a tin wire. It is usually best to remove such components using a heat gun. Hold a heat gun in one hand to blow the solder, and use a clamp such as a tweezer to remove the parts while the solder melts with the other hand.

3. Similar steps

For components with high pin density, the welding procedure is similar, i.e., one pin is welded first and the other pins are welded with tin wire. The number of pins is large and dense, and the alignment of pins and pads is the key. Usually, a small amount of tin is selected for the solder pad at the corner. Use tweezers or hands to align the component with the pad, align the edges with the pins, press the component firmly against the PCB, and weld the corresponding pins of the pad with the soldering iron. confirmed that many of these parts are virtual welding. This situation is more common in manual plug-in welding because the temperature of the soldering iron is inappropriate and the welding time is too short. Poor tin penetration of PCBA is easy to lead to weld problems and increases the cost of repair. If PCBA has high requirements for tin penetration and strict welding quality requirements, selective wave soldering can be adopted to effectively reduce the problem of poor tin penetration of PCBA.