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BGA (Ball Grid Array) is a packaging method used in SMT (Surface Mount Technology) chip processing. As the number of I/O pins on integrated PCB circuit boards increased, the importance of IC packaging also increased. BGA packaging was developed considering the miniaturization and precision of electronic equipment.
Here are some basic processing information about BGA:
1. Steel mesh: The thickness of the steel mesh used in BGA welding should be appropriate. Thick steel mesh may cause a tin connection.
2. Solder paste: BGA devices have small pin spacing, so the metal material particles used in the solder paste should also be small. Excessive metal material particles can cause issues in the SMT process.
3. Welding temperature setting: A reflow oven is generally used in the SMT patch processing. The temperature of each area must be set according to the processing regulations, and the temperature around the spot welding must be detected.
4. Inspection after welding: After SMT processing, strict inspections should be carried out on BGA packaged devices to prevent SMD defects.
What is BGA in SMT chip processing?
5. Advantages of BGA packaging:
- Increased assembly yield
- Improved electric heating performance
- Reduced volume and mass
- Reduced parasitic parameters
- Small signal transmission delay
- Increased frequency of use
- Good product credibility
6. Defects of BGA packaging:
- Inspection after welding must be based on X-ray
- Increased electronic production costs
- Increased repair costs
BGA packaging has a high degree of difficulty in SMT chip soldering, and casting defects and rework are also more difficult to operate. Ensuring the soldering quality of BGA devices is essential.
Why Choose China PCBA Supplier KSPCBA as Your SMT chip processing Manufacturer?
– Experienced and skilled team
– State-of-the-art equipment
– Strict quality control
– Excellent customer service
– Competitive price
Please send Email to kspcba@c-alley.com or call us through +86 13828766801 Or submit your inquiry by online form. Please fill out below form and attach your manufacturing files( PCB Gerber files and BOM List) if need quotation. We will contact you shortly.
+86 13828766801
kspcba@c-alley.com
https://www.kingshengpcba.com/
2/F, Building 6, Tangtou 3rd Industrial Zone, Tangtou Community, Shiyan Town, Baoan District, Shenzhen, China, 518108
We would also like to thank our customers for their trust and support. The company's outstanding achievements are mainly due to the loyalty of our customers, which also encourages and spurs our company to forge ahead.
