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The Ball Grid Array (BGA) is a SMT package that can have many hundreds of pins. It has become one of the most popular packages for high pin-counts because the entire bottom surface of the device can be used, instead of just the perimeter. BGA devices are not suitable for socket mounting and must be soldered. This requires precise, automated placement and heating. ACME PCB Assembly is capable of placing BGAs with either tin-lead, or lead-free (RoHS) solders.
Once installed, the BGAs must be inspected to establish the quality of solder joints. At ACME PCB Assembly, we utilize X-ray inspection followed by a state-of-the-art microscope inspection of solder joints of the BGA.
Kingsheng PCBA Tech. has been devoting itself to OEM/ODM project since its establishment. Taking ISO9002 and other international standards, Kingsheng PCBA Tech. has enjoyed a good image and enviable reputation for the high-quality OEM products, competitive price, timely delivery and attractive after-sale service
Please send Email to kspcba@c-alley.com or call us through +86 13828766801 Or submit your inquiry by online form. Please fill out below form and attach your manufacturing files( PCB Gerber files and BOM List) if need quotation. We will contact you shortly.
+86 13828766801
kspcba@c-alley.com
https://www.kingshengpcba.com/
2/F, Building 6, Tangtou 3rd Industrial Zone, Tangtou Community, Shiyan Town, Baoan District, Shenzhen, China, 518108
We would also like to thank our customers for their trust and support. The company's outstanding achievements are mainly due to the loyalty of our customers, which also encourages and spurs our company to forge ahead.
