Analysis and Simulation of PCBA stress detection - KingSheng PCBA

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Analysis and Simulation of PCBA stress detection for automotive electronics

For automotive electronics PCB 'a stress injury, using KT method of systematic andcomprehensive analysis of the production process, and combined with the FEA simulation and actual process validation and eventually to the failure caused by the root causes of. Finally, the two aspects of the production process and product design are improved,the problem of the A PCB stress is solved completely.

Introduction

Automobile electronic products in the production process will be more or less by the external mechanical forces caused by the product the whole or local deformation and warpage, thus to the products of the solder joints or device caused by mechanical damage, but this damage sometimes are not necessarily immediately caused failure, but a hidden mechanical damage. This damage we usually judge the size of the other stress according to the strain rate of the device.. Stress detection is a reflection of the stress of an object, the strain is the deformation rate after force.

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