Testing Flexible Circuits, Part I: Requirements and Procedures

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In this first of a three part series regarding tests for flexible circuits, I will examine overall requirements and procedures; the second installment will focus on raw materials, and the third and final part will focus on testing for bare flexible circuit and circuit assemblies.

We get many inquiries that are related to what tests and specifications a flexible circuit should pass. A starting point for specification/testing discussions should start with IPC 6013: Qualification and Performance Specification of Flexible Printed Boards. This comprehensive document can be a starting point for specification/testing discussions, and is often all that is needed, as it provides detailed performance criteria for flexible circuits, including more than 23 different test methods that pertain to the raw materials and final product. In fact, it is universally accepted as the industry standard for flexible circuits. Originally published in 1998, it is periodically updated and revised by an IPC committee that consists of members that represent material suppliers, fabricators, testing facilities, end users and representatives from various associations, as materials, technologies and applications advance.

As most people in the industry are aware, IPC is a global association dedicated to excellence in the printed board manufacturing, electronics assembly and test industry. It is the leading source for standards, test methods, training, market research and policy for its member industries, with a current membership of more than 3500 members worldwide. Originally founded in 1957 as “Institute for Printed Circuits,” the name was subsequently changed to the “Association Connecting Electronics Industries” to reflect its broadening of scope from bare circuit boards to full electronic assemblies.