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HDI Board Manufacturing Capacities & Testing.
High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB).
HDI custom PCB is widely designed for reducing the weight and overall dimensions of products, as well as enhancing electrical performance of the devices, but it require high requirement on finer lines and spaces, smaller vias & capture pads, and higher connection pad densities.
Mostly finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (<400 µm), I/O>300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.
HDI Structures | Type of micorovias | Mass production | Middle/small batch | Prototype | Apply to |
1+N+1 | Blind vias | Yes | Yes | Yes | 4 layers+ |
2+N+2 | Blind/Buried staggered vias | Yes | Yes | Yes | 6 layers+ |
2+N+2 | Blind/Buried staggered vias | Yes | Yes | Yes | 6 layers+ |
3+N+3 | Blind/Buried staggered vias | / | Yes | Yes | 8 layers+ |
3+N+3 | Blind/Buried staggered vias | / | / | Yes | 8 layers+ |
Please send Email to kspcba@c-alley.com or call us through +86 13828766801 Or submit your inquiry by online form. Please fill out below form and attach your manufacturing files( PCB Gerber files and BOM List) if need quotation. We will contact you shortly.