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A variety of different BGAs including micro BGAs require the latest in x-ray inspection to assure quality and reliability by playing a vital role in ascertaining wire-bonding integrity.
Kingsheng PCBA regular and automated x-ray inspections (AXI) are used on the assembly floor. AXI is used for leading edge technologies such as ball-grid arrays (BGAs), chip scale packaging, flip chips, QFNs, DFNs, and others. It shines x-ray radiation through a component package like a BGA to view images including wire bonding, solder joints, and solder defects, if any. Standard x-ray inspection is used for simple applications, whereas high-end x-ray is used to detect such defects as head-on-pillow, disjointed balls on a BGA package, wire bonding damage, and other similar problems.
Please send Email to kspcba@c-alley.com or call us through +86 13828766801 Or submit your inquiry by online form. Please fill out below form and attach your manufacturing files( PCB Gerber files and BOM List) if need quotation. We will contact you shortly.
+86 13828766801
kspcba@c-alley.com
https://www.kingshengpcba.com/
2/F, Building 6, Tangtou 3rd Industrial Zone, Tangtou Community, Shiyan Town, Baoan District, Shenzhen, China, 518108
We would also like to thank our customers for their trust and support. The company's outstanding achievements are mainly due to the loyalty of our customers, which also encourages and spurs our company to forge ahead.
