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Because of the recent implementation of environmental standards, such as RoHS, WEEE, and others in 2006, the use of a lead-free assembly compatible laminate material is now required, kingshengPCBA identical with the latest standard .
The laminate material must withstand the increased temperatures of lead-free assembly without evidence of delamination of the base material. The temperatures for a typical tin-lead assembly process compared to a lead-free assembly have increased 20ºC to 50ºC and thus present unique challenges that require special attention by users during Kingsheng PCB processing,PCB packaging, storage, and lead-free assembly processing.
Control of moisture/volatiles in the base material is one of the most critical aspects of manufacturing a leadfree PCB assembly. The vapor pressure of water increases dramatically from approximately 300 PSI to over 600 PSI resulting in stresses that can easily over come the bonds at critical laminate interfaces when the Maximum Moisture Content (MMC) is exceeded.
Recent studies by Isola have demonstrated that there is a functional limit to the amount of moisture/volatile that can be allowed in the substrate before the onset of delamination will occur during lead-free assembly.
There is no easy solution for solving moisture/volatile issue. Since laminate materials will absorb moisture/volatile, Isola strongly recommends implementing best practices for PCB packaging, storage, handling, assembly, and rework address this problem. The objective of this technical bulletin is to offer best practice recommendations to our valued customers.
Please send Email to kspcba@c-alley.com or call us through +86 13828766801 Or submit your inquiry by online form. Please fill out below form and attach your manufacturing files( PCB Gerber files and BOM List) if need quotation. We will contact you shortly.