KingshengPCBA ENIG Techniques - KingSheng PCBA

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ENIG (Electroless Nockel/Immersiion Gold) Kingsheng PCBA is good at the PCBA field,special in the PCB surface finishing.

Electroless nickel is an auto catalytic process using a precious metal catalyst and inernal reducing agent for continuous deposit as long as the chemistry is maintained in an active state.During the chemical reaction, a small amount of phosphorus is co-deposited into the nickel creating the desired proterties as previosly mmentioned. Due to the nature of electroless process, the nickel deposit may be engineered to a variety of specified thicknesses,but deposits of 100=200 microinches(2.5-5.0 mircrons) are typical.

In contrast,imersion gold is deposited in an exchange reaction. As the nickel plated part is introduced into the gods solution, a chemical exchange occurs replacing nickel on the surface with a thin layer of pure gold. THe reaction stops when all of the exposed nickel is replaced with gold, thus an upper limit of approximately 8 microinches(0.2 microns) is found with the process.

Kingsheng PCBA can also make copy PCB, and decode IC with Hitachi screen printer, FUJI NXT-ii&FUJI XPF-L Modules SMT machines