Reflow Soldering in Kingsheng PCB Assembly- China PCBA Supplier

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Kingsheng PCBA design Wave soldering has been the standard large-scale industrial method for such electronic PCB assembly. The name comes from the waves of solder required to glue the component to the circuit PCBA board.

An alternative soldering method is to apply the PCBA design solder paste on the top side of the printed PCBA circuit board and around an annular ring. This forms a temporary attachment of the component to the PCBA circuit board. The PCB assembly is then heated under controlled conditions to melt the solder and to form a permanent PCBA connection. This process is commonly known as PCBA reflow soldering or Pin-in-Paste (PiP) or Pin-in-Hole (PiH) soldering.

Reflow soldering is the most common method of attaching PCBA surface mount components to a PCBA circuit board, although it can also be used for through-hole components by filling the holes with PCBA solder paste and inserting the PCBA component leads through the paste. Because PCBA wave soldering can be simpler and cheaper, reflow is not generally used on pure PCB through-hole boards. When used on PCBA boards containing a mix of SMT and THT components, through-hole reflow allows the PCBA wave soldering step to be eliminated from the PCB assembly process, potentially reducing PCB assembly costs.

The goal of the reflow process is to melt the solder and heat the adjoining surfaces, without overheating and damaging the electrical components. In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.

Although the PiP process has been used in the SMT assembly ministry for over a decade, it still faces a number of challenges. The most important one is that standard PCBA components are PCBA designed for the PCB wave soldering process and cannot withstand the higher PCBA reflow soldering temperatures.

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