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Panelization is a procedure whereby a number of PCBs are grouped for manufacturing onto a larger board - the panel. Usually a panel consists of a single design but sometimes multiple designs are mixed on a single panel. There are two types of panels: assembly panels - often called arrays - and bare board manufacturing panels. The assemblers often mount components on panels rather than single PCBs because this is efficient.[11] The bare board manufactures always uses panels, not only for efficiency, but because of the requirements of the plating process. Thus a manufacturing panel can consist of a grouping of individual PCBs or of arrays, depending on what must be delivered.
The panel is eventually broken apart into individual PCBs; this is called depaneling. Separating the individual PCBs is frequently aided by drilling or routing perforations along the boundaries of the individual circuits, much like a sheet of postage stamps. Another method, which takes less space, is to cut V-shaped grooves across the full dimension of the panel. The individual PCBs can then be broken apart along this line of weakness.[12] Today depaneling is often done by lasers which cut the board with no contact. Laser panelization reduces stress on the fragile circuits.
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