Kingsheng PCBA Reflow Soldering in PCB Assembly - China PCBA Supplier

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Kingsheng PCBA Company

The majority of components used by the electronics industry today are provided as Surface Mount Technology, or SMT, assembly components. But other PCB components such as connectors that need through-hole leads for mechanical strength still have to be soldered to a printed circuit board.

PCBA Wave soldering has been the standard large-scale industrial method for such electronic assembly. The name comes from the waves of solder required to glue the component to the printed circuit board- Shenzhen Kingsheng PCBA.

An alternative soldering method is to apply the PCB solder paste on the top side of the printed circuit board and around an annular ring. This forms a temporary attachment of the PCB component to the printed circuit board (KingshengPCBA). The assembly is then heated under controlled conditions to melt the solder and to form a permanent connection. This process is commonly known as PCBA reflow soldering or Pin-in-Paste (PiP) or Pin-in-Hole (PiH) soldering.

The PiP process lowers both SMT assembly production costs and the degradation of the printed circuit board because in the latter case, the PCB board is subject to fewer thermal impacts. In addition, the PiP process ensures that the solder melts uniformly and the PCB board remains at an even temperature throughout its thickness.

In traditional PCBA wave soldering, the bottom of the circuit board (Kingsheng PCBA)acts as a heat sink and remains at a higher temperature than the top. This produces a temperature gradient where the PCB solder migrates to the bottom of the board rather than filling in the joint at the top. Operators can never completely eliminate this temperature gradient, even with side heating. So the joint is always only partly filled - KingshengPCBA.

Although the PiP process has been used in the SMT assembly ministry for over a decade, it still faces a number of challenges. The most important one is that standard components are designed for the Kingsheng PCBA wave soldering process and cannot withstand the higher reflow soldering temperatures.

The PiP process also requires an adequate component stand-off prior to assembly. The stand-off can be defined as the height of the component above the printed circuit board - KingshengPCBA after reflow soldering.

The operator has to be able to calculate the stand-off prior to pcb soldering to ensure that all of the components remain at the same height above the board after soldering. Sometimes this may involve the use of other heat sinks or thermal pads to counter the difference in final component heights.