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How to produce a qualified smart mobile phone PCBA with a BGA components assembly? After the new year of 2018 in China, the company of Shenzhen Kingshengpcba Tech. Co.,Ltd got a order with more than 10 0000pcs for smart mobile phone PCBA production. One of the motherboard has a 0.35 PITH BGA, SPI reported the problems of less tin after printing. The engineer department from Shenzhen Kingshengpcba Tech. Co.,Ltd have found the best solution for them.
Nowadays, more and more OEM manufacturer have problems during smart mobile phone PCBA production, and problems details as below,
1. hole steel net 0.21mm round square, No. 5 powder solder paste printing machine;
2. DEK printing machine, without the use of vacuum fixed;
3. 45 and 60 degree scrapers have been tested, or less tin.
How to solve, please contact with people from Shenzhen Kingshengpcba Tech. Co.,Ltd .
Please send Email to kspcba@c-alley.com or call us through +86 13828766801 Or submit your inquiry by online form. Please fill out below form and attach your manufacturing files( PCB Gerber files and BOM List) if need quotation. We will contact you shortly.
+86 13828766801
kspcba@c-alley.com
https://www.kingshengpcba.com/
2/F, Building 6, Tangtou 3rd Industrial Zone, Tangtou Community, Shiyan Town, Baoan District, Shenzhen, China, 518108
We would also like to thank our customers for their trust and support. The company's outstanding achievements are mainly due to the loyalty of our customers, which also encourages and spurs our company to forge ahead.
