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SMT procedure belongs to a type of solder craft during which paste solder that is distributed to PCB pad in advance is melted through reflow oven so that mechanical and electric connection is implemented between soldering points or pins of SMDs and PCB pad. It is suitable for the soldering of all types of SMDs. The major steps of SMT include tin paste printing, components mounting and reflow soldering.
Solder paste printing station
This station mainly consists of solder paste, model and solder paste printer. Solder paste is first printed on the corresponding position of PCBs from professional solder paste model through solder paste printer. Then electronic components soldering is finished through components mounting and reflow soldering.
Please send Email to kspcba@c-alley.com or call us through +86 13828766801 Or submit your inquiry by online form. Please fill out below form and attach your manufacturing files( PCB Gerber files and BOM List) if need quotation. We will contact you shortly.