PCB Laminates - Printed Circuit Board(PCB), China PCBA Supplier

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Laminates are manufactured by curing under pressure and temperature layers of cloth or paper with thermoset resin to form an integral final piece of uniform thickness. The size can be up to 4 by 8 feet (1.2 by 2.4 m) in width and length. Varying cloth weaves (threads per inch or cm), cloth thickness, and resin percentage are used to achieve the desired final thickness and dielectric characteristics. Available standard laminate thickness are listed in ANSI/IPC-D-275.

The cloth or fiber material used, resin material, and the cloth-to-resin ratio determine the laminate's type designation (FR-4, CEM-1, G-10, etc.) and therefore the characteristics of the laminate produced. Important characteristics are the level to which the laminate is fire retardant, the dielectric constant, the loss factor, the tensile strength, the shear strength, the glass transition temperature (Tg), and the Z-axis expansion coefficient (how much the thickness changes with temperature).

Depending on the needs of the circuit, a wide variety of dielectrics can be selected to offer various insulating properties. Polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1, and CEM-3 are a few of these dielectrics. FR-2 (phenolic cotton paper), FR-3 (cotton paper and epoxy), FR-4 (woven glass and epoxy), FR-5 (woven glass and epoxy), FR-6 (matte glass and polyester), G-10 (woven glass and epoxy), CEM-1 (cotton paper and epoxy), CEM-2 (cotton paper and epoxy), CEM-3 (non-woven glass and epoxy), CEM-4 (woven glass and epoxy), and CEM-5 (woven glass and polyester) are well-known pre-preg materials used in the PCB industry. When using ball grid array (BGA) and naked die technologies, thermal expansion is particularly vital to take into account. Glass fiber provides the best dimensional stability.

FR-4 is by far the most common material used today. The board stock with unetched copper on it is called "copper-clad laminate".

With decreasing size of board features and increasing frequencies, small nonhomogeneities like uneven distribution of fiberglass or other filler, thickness variations, and bubbles in the resin matrix, and the associated local variations in the dielectric constant, are gaining importance.

Printed circuit boards, sometimes known as PCBs, are a vital part of all electronic devices, from straightforward calculators to sophisticated computers and smartphone systems. A printed circuit board, or PCB, is a flat board having conductive components and paths affixed to a non-conductive substrate. The PCB lamination is one of an essential part of a PCB.

The PCB lamination is the source of a printed circuit board. A laminate is the foundation material or non-conductive substrate that PCBs are made on. It is a composite material composed of fiberglass fabric layers that have had epoxy resin injected into them. To form a solid sheet of material, the layers of fiberglass are layered on top of one another and compressed together using heat and pressure. As a result, the PCB's components and conductive pathways are supported by a flat, stiff board.