PCB Common Substrates - China PCBA Supplier

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Conductive metal films and non-conductive laminates, or dielectric materials, are used to make PCBs. Substrates such as FR-4, ceramic, and composite epoxy materials (CEM) are used to create laminates.

Base layers comprise the printed circuit board (PCB) substrate materials. Usually, they are constructed from a blend of insulating materials (such fiberglass or plastic) that offer electrical connectivity, mechanical support, and insulation. Typical substrate materials for PCBs consist of:

FR-2, phenolic paper or phenolic cotton paper, paper impregnated with a phenol formaldehyde resin. Common in consumer electronics with single-sided boards. Electrical properties inferior to FR-4. Poor arc resistance. Generally rated to 105 °C.

FR-4, a woven fiberglass cloth impregnated with an epoxy resin. Low water absorption (up to about 0.15%), good insulation properties, good arc resistance. Very common. Several grades with somewhat different properties are available. Typically rated to 130 °C.

Aluminum, or metal core board or insulated metal substrate (IMS), clad with thermally conductive thin dielectric - used for parts requiring significant cooling - power switches, LEDs. Consists of usually single, sometimes double layer thin circuit board based on e.g. FR-4, laminated on aluminum sheet metal, commonly 0.8, 1, 1.5, 2 or 3 mm thick. The thicker laminates sometimes also come with thicker copper metalization.

Flexible substrates - can be a standalone copper-clad foil or can be laminated to a thin stiffener, e.g. 50-130 μm

Kapton or UPILEX, a polyimide foil. Used for flexible printed circuits, in this form common in small form-factor consumer electronics or for flexible interconnects. Resistant to high temperatures.

Pyralux, a polyimide-fluoropolymer composite foil.