DIP soldering - Leading PCB Assembly Manufacturer, Printed Circuit Board(PCB), China PCBA Supplier

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Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not protected with solder mask), creating a reliable mechanical and electrical connection.

To create electronic assemblies, dip soldering is a small-scale soldering technique that joins electronic components to printed circuit boards (PCBs). The exposed metal portions of the board (those not shielded by the solder mask) are penetrated by the solder, which creates a sturdy mechanical and electrical connection. Surface mount and through-hole printed circuit assembly both employ dip soldering. This is one of the least expensive soldering techniques, and small businesses in underdeveloped nations frequently employ it. The manual counterpart of automatic wave soldering is called dip soldering. A tiny tank of molten solder is the sole piece of equipment needed. Melted solder is applied to the exposed metal components of the populated PCB by hand submerging it in a tank.

Features:

Good gloss, bright plating layer, silver white color;

Long service time of solder;

Good process performance: Excellent floatability, continuously even plating layer of hot-tinned copper wire; solder dust free on surface, mold-plugging and break free during wire twisting; exposed copper, crack and solder heap free.

Good residue resistance in liquid state: Resides fewer than other lead-free solders;

Good anti-aging performance: The hot-tinned wire’s surface can remain glossy, without yellow and dark color or black spots, after kept under the temperature of 80-200℃ for 3 hours. It can still keep good solderability after placed under the temperature 155℃ for16 hours, suggesting a good anti-aging performance.

Dip solder process

To do immersion soldering, submerge the components that need to be joined into a molten solder bath. Therefore, a filler metal is applied to every surface of the component. Solder is very wettable and has a low surface tension.

Solder comes in a variety of forms, each with a distinct application. Strength is increased above room temperature by using lead-silver. Lead and tin are utilized as all-purpose solders. Aluminum is made by tin zinc. At high temperatures, cadmium silver is employed for strength. Zinc aluminum is used to resist corrosion and aluminum. Electronics uses tin-bismuth and tin-silver. Lead-free solders have been created and are becoming increasingly popular due to the toxicity of lead. In the molten bath, suitable filler metals can be employed, although the choice is typically restricted to elements with lower melting points. Tin-lead and zinc-aluminum solders are used in the majority of dip soldering procedures. Steel or cast iron solder pot metal heated by electricity.

Bath temperature: 350–400 °C (lead-free alloys) or 220–260 °C (tin–lead binary alloys) Solder composition: eutectic alloy or 60% Sn, 40% Pb.