What Is BGA - Printed Circuit Board(PCB), China PCBA Supplier

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(Ball Grid Array) A well-liked surface mount chip package with connections made up of a grid of solder balls. BGA is renowned for its small size, high lead count, and low inductance, which enables the use of lower voltages. It is offered in plastic and ceramic variants. The leads on BGA chips, also referred to as "solder balls" or "solder bumps," are spaced widely apart than those on leaded packages, making them easier to align to the printed circuit board. BGA has paved the way for chip scale packaging (CSP), in which the package is no larger than 1.2 times the size of the semiconductor die itself since the leads are located underneath the chip.

BGA's full name is Ball Grid Array, which is an array of solder balls on the bottom of the package substrate as the I/O end of the circuit and the printed circuit board (PCB). The device packaged with this technology is a surface mount device.

BGA packaging emerged in the early 1990s and has evolved into a mature high-density packaging technology. Among all the package types of semiconductor ICs, the BGA package grew fastest during the five years from 1996 to 2001. In 1999, the output of BGA was about 1 billion. However, to date, this technology has been limited to packages of high-density, high-performance devices, and the technology is still moving toward fine pitch and high I/O ends. BGA packaging technology is mainly suitable for PC chipset, microprocessor/controller, ASIC, gate array, memory, DSP, PDA, PLD and other devices.

Conducting and insulating layers make up a BGA, which is topped with a solder mask that is often green but can also be black, blue, red, or white. Thin copper foil, which has a specific thickness measured in micrometers or ounces per square foot, typically makes up the conducting layers. Pre-preg composite fibers made of epoxy resin are typically used to connect the insulating layers together. The material used for insulation is dielectric.

Ball grid array, or BGA, technology is now widely used. Even though it might seem that there would be problems if you couldn't access the contacts, appropriate solutions have been discovered. As track and pin density have decreased, PCB layout and board dependability have increased. Soldering has also gotten more dependable, and infrared reflow techniques have been enhanced to facilitate reliable soldering. Similar to this, X-ray inspection and AXI can be used to inspect boards that use BGAs. Rework procedures have also been developed. Consequently, quality and dependability have generally improved as a result of the application of BGA technology.