What's the Differences Between Through Hole and Surface Mounted technology?

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The need for enhanced functionality, reduced size, and higher utility has led to rapid evolution in semiconductor packaging in recent years. There are two primary ways to place components on a PCB in a modern PCBA design: through-hole mounting and surface mounting.

There are some points that make SMT different from Through Hole, which have been briefly summarized below:

SMT has helped significantly in solving the space problems that were commonly noticed with the Through Hole mounting.

In SMT, the components are leadless and are directly mounted to the board surface. In Through Hole the components have lead wires that are taken to the wiring boards via surface mount technology holes.

The Pads on the surface in SMT are not used for connection of layers on the printed wiring boards.

SMT has made possible applications that seemed impossible with through hole.

SMT is suitable for high volume production that gives access to lowered cost of unit assemblies which is not possible with through hole technology.

SMT has a disadvantage as the capital investment involved in its machinery and production is higher.

Compared to surface-mounted components, through-hole components are more costly. SMT components occupy less space on the circuit board since they are smaller than THT components. The equipment used for Pick and Place reduces production time. The printed circuit board can be used on both sides.

All things considered, surface mounting will nearly always turn out to be more economical and successful than through-hole mounting. Nowadays, it is present in over 90% of PCBAs. However, THM will remain relevant well into the future due to unique mechanical, electrical, and thermal factors.

Selecting an appropriate configuration technique to make your board work can be difficult. Surface mount technology is used in more than 90% of PCBs made today, but which one is best for you? When opposed to through-hole technology, surface mounting primarily exhibits higher efficiency and price. It allows for a high component density and lightweight architecture.

However, certain mechanical, electrical, and temperature requirements will make THT mounting necessary going forward, guaranteeing its continuous applicability for a considerable amount of time.