Inner layer inspection process - China PCBA Supplier

About Us | Events | Company Structure | Management Staff Structure | Market Focus | Company Certification | Our Services

It is possible to specifically break down the inner layer processing of printed circuit boards into five steps: resist stripping, inner layer etching, inner layer imaging, inner layer pre-processing, and inner layer AOI inspection.

To make sure the panel is free of flaws like open and short circuits, nicks, and copper residues after etching, the machine checks the digital image of the etched pattern generated from the scan with the original design in the Gerber file.

AOI detection:

Full name Automatic Optical Inspection

Purpose:

The image is fed back to the device processing by the optical reaction principle, and compared with the logic judgment principle or the data pattern of the design, the defect position is found.

Precautions:

Since the test method used by AOI is logical comparison, there must be some shortcomings of misjudgment, so it needs to be confirmed manually.

It is best to process the multi-layer circuit board on the inner layer first because in printed circuit boards, the working layer of the inner layer is sandwiched in the middle of the board.

KingShengPCBA uses OMRON AOI platforms to create and implement solutions and applications. With its own color-illumination algorithms, off-axis functionality, and distinctive zoom, the OMRON is a true inspection innovation. AOI is a reflection of Kingsheng's dedication to offering cutting-edge, reasonably priced test and inspection solutions for today's high-tech products.