Attention for BGA Layout Design during PCBA processing

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The increasing intelligence and sophistication of electronic products necessitates improved PCBA processing and good design to yield high-quality products. BGA layout design demands special attention in PCB design, as improperly placed BGAs can easily result in PCBA quality issues. As a result, PCBA manufacturers have introduced requirements for PCBA processing in BGA layout design.

The effect of PCBA processing on BGA layout

The solder joints' BGA size and narrow cross-sectional area result from the PCB bending, which turns the solder joints' four corner pieces into stress concentration areas. If the PCBA processing induces excessive stress, the solder joints are likely to crack.

BGA has a large pad package but the solder jointa is small.

BGA layout design requirements

1.Place the PCB near the transfer side as close as possible. Because the deformation is relatively small during soldering.

2.Avoid layout at the corners of the L-shaped plate and near the crimp connector.

3.Avoid mirroring the front and back side. If it is necessary, the thickness of the PCB should be ≥ 2.0mm, which is mainly considered from the long-term reliability. The reliability of the mirror layout BGA will be reduced more than 50%.

4.The PBGA should avoid to layout on the first assembly surface (first welding surface, Bottom surface).

5.The BGA should be avoided to near the edge of the imposition.

BGAs are surface-mounted onto PCBs using BGA sockets. BGA sockets facilitate the easy mounting of BGA chips onto PCBs. The biggest issue in mounting an integrated circuit on a printed circuit board (PCB) is that soldering each pin of the IC individually can be somewhat challenging. Additionally, if done incorrectly, the mounting process can be quite time-consuming and stressful. These issues are resolved with the use of BGA sockets. Rectangular plastic sockets with spaces on the underside to hold the solder balls of BGA chips are known as BGA sockets.