Ordinary wave soldering for PCB assembly

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Wave soldering is the procedure of employing a molten solder alloy (lead-tin) with an electric or electromagnetic pump to create a desired wave-shaped solder pool. Nitrogen gas can alternatively be injected into the solder pool to generate the solder wave. A printed circuit board (PCB) laden with components is fed through the solder wave during this operation, forming a particular type of solder peak on the molten solder's surface. As a result, solder junctions can be created on the PCB by soldering components positioned at particular angles and immersion depths through the solder wave. We call this entire procedure "wave soldering."

1. Wave soldering solder joint requirements: solder joints are full, shiny, not short of large area, short of tin, etc.

2. The flux spray method of wave soldering furnace is generally spray type.

3. The specific gravity of the flux of the spray wave soldering furnace is measured only every 4 hours.

4. Measurement of flux density: Use a general liquid density meter and insert it into the flux in the flux tank of the wave soldering furnace. After inhaling a certain amount of flux, read the density number directly.

5. Follow up the situation of the flux and wave soldering furnace used by the company. Generally, the preheating temperature is controlled in the range of 80 ° -130 °.

6. To measure the preheating temperature, a special process temperature tester is used to simulate the operation of the PCB in a wave solder furnace to record the actual process temperature;

7. The melting temperature should generally be controlled at 240 ° -250 °.

8. When measuring the melting tin temperature, use a special process temperature tester to measure at the normal production cycle.

9. The soldering time refers to the time during which a certain point on the bottom surface of the PCB running in the wave soldering furnace is in contact with the molten tin. The welding time is generally controlled between 2-4 seconds.

10. After the tin in the tin furnace is used for a period of time, the copper content will increase; the copper removal and solder content copper testing should be performed regularly.

In many large-scale electronic applications, reflow soldering has largely superseded wave soldering due to the widespread adoption of surface mount technology (SMT) to replace through-hole components. Wave soldering is still highly needed in some applications where SMT is not appropriate, like big power devices, high-pin-count connectors, or sectors where through-hole technology is the norm.

Wave soldering still has its own merits that make it a good option for PCB assembly, even though other soldering techniques like selective soldering are being used more and more.