The overall problem in the PCB assembly process: elastic cracking

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In terms of technology, flexible cracking means excessive bending of the PCB under the ceramic chip capacitor. Ceramic chip capacitors cannot withstand excessive stress due to their brittleness. In order to obtain sufficient electrical performance, some printed circuit boards will require large capacitors. The stress on the capacitor may be due to accidental drop or excessive weight placed at any stage of PCB assembly. The type of ceramic chip capacitor you use in the design stage should be able to handle the pressure of assembly and should not easily break. You can respond to bending cracking problems by using shorter capacitors, or you can replace capacitors with smaller cells with the same capacitance and voltage.