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The form of solder joints that are created during the soldering process greatly affects how reliable electrical goods are. Although a number of techniques have been developed to forecast the shape of solder joints, the precise shape variations brought about by changes in the liquid-solid phase and thermal deformation of PCBs have not been completely studied.
PCBA test requirements:
The contact requirements of ICT stylus are mainly caused by obstructing objects on the solder joints, which causes the contact resistance to rise, so the stylus is not well-connected. The flux residue is the most insulating material.
BGA function test and maintenance requirements:
In order to improve the speed of BGA maintenance, it is necessary to consider when designing the BGA, the BGA pin is pulled out, the circuit is designed, and the exposed test point (PAD)
Please send Email to kspcba@c-alley.com or call us through +86 13828766801 Or submit your inquiry by online form. Please fill out below form and attach your manufacturing files( PCB Gerber files and BOM List) if need quotation. We will contact you shortly.
+86 13828766801
kspcba@c-alley.com
https://www.kingshengpcba.com/
2/F, Building 6, Tangtou 3rd Industrial Zone, Tangtou Community, Shiyan Town, Baoan District, Shenzhen, China, 518108
We would also like to thank our customers for their trust and support. The company's outstanding achievements are mainly due to the loyalty of our customers, which also encourages and spurs our company to forge ahead.
