DIP Workshop PCBA Board Inspection Project Standard

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The acronym for Dual-In-Line Package is DIP. It is one of the most popular IC packaging techniques for through-hole technology. It can instead be shortened to DIL. This kind of packaging is manufactured from opaque met-molded epoxy resin and has a lead frame connected to support the chip and serve as connection pins that protrude vertically from the plastic rectangular home. The parallel metal pins on both sides of the IC should be plated for a clean look, but plating them in gold, silver, or tin is not required.

Drilled-through holes are used to place DIP components on the board or insert them into the circuit socket. You should be aware that DIP is also known as DIPn, where n is the total number of pins in the component. A THT IC package with two rows of ten pins, for example, would be designated DIP20. You will frequently see packages containing four to sixty-four pins. Pins can occasionally reach 100.

01, DIP part welding spot welding

02, Cold welding of DIP parts: Use a toothpick to lightly touch the pin of the part, if it can be moved, it is cold welding

03, DIP parts (solder point) short circuit (tin bridge)

04, DIP parts are missing:

05, DIP parts pin length: Φ≤0.8mm→the pin length is less than or equal to 1.5mm Φ＞0.8mm→the pin length is less than or equal to 2.0mm, except for special trimming requirements

06, DIP parts are wrong:

07, The polarity of DIP parts is reversed or wrong, causing burning or explosion

08, DIP parts foot deformation: the lead bending exceeds 50% of the thickness of the lead

09, DIP parts floating high or high warping: refer to IPC-A-610E, according to the special circumstances of the assembly

10. Tin tip of DIP part soldering point: The height of tin tip is greater than 1.5mm

11. DIP parts cannot be identified: (printing is blurred)

12. DIP part foot or body oxidation

13. Damaged DIP part body: The surface of the component is damaged, but the metal material inside the component is not exposed

14. DIP parts use non-designated suppliers: according to BOM, ECN

15. Vertical filling and peripheral wetting of PTH holes: at least 75% vertical filling, pins and hole walls are wetted at least 270o

16. Tin ball/tin dross: More than 5 solder balls or solder splash (0.13mm or less) per 600mm2 is (MA)

17. The solder joints have pinholes/blow holes: a solder joint has three (including) or more as (MI)

18. Crystallization phenomenon: There are white residues on the surface of the PCB board, solder terminals or around the terminals, and white crystals on the metal surface

The DIP component's size is determined by the pin number. We have a pin count consisting of all even numbers from four to twenty, followed by 28 and 40, which makes up the most widely used pinned DIPs. Pitch diameters vary in the pins that are connected to the DIP components. Pitch values for these include 0.5, 0.65, 1.27, and 2.54 in millimeters. Prototype boards, Vero boards, and breadboards can all have the components mounted on them thanks to the pitches' design. It is advisable to note that there are a few unique situations where unique DIP pitches are needed.