The New Components And High-Density Assembly Technology

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In circuit board design, a high-density board can make all the difference. It is the kind of printed circuit board (PCB) that allows the components to be positioned or placed closer together. Because of this unification and the dense wiring that enables faster connections on the board, the signal integrity of the board can be increased.

1. What is high density?
High density includes high-density layout and high-density component installation.
The component mounting density on the printed circuit board is higher than 50/cm2, and the solder joint density is higher than 100/cm2.
High-density installation pitch of components.
Layout density: layout density above level 4 is high density.

2. What is the new component assembly technology?
BTC components: only components with solder terminals on the bottom, for example, grid array components FN, LCCC; column grid array components CCGA, LGA, and only chip inductor coils with solder terminals on the bottom.
BGA/CSP with pin center distance less than 0.4mm, etc.
In recent years, new micro and small components such as 01005 and metric 03015 have appeared.

Conventional SMT technology, such as solder paste printing, patching and soldering on ordinary FR-4, is already a conventional pcb assembly process in PCBA Factory, not an advanced manufacturing technology.

Selecting a professional to complete the task is crucial now that you have decided to deal with the HDI PCB. In comparison to conventional circuit boards, Hillman Curtis is a skilled HDI PCB manufacturer that provides wide coverage, enables you to insert more components on both sides of the board, reduces the size of the PCB, and saves money.