PCBA basic failure analysis method - China PCBA Supplier

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The PCBA board is a crucial component in all electrical equipment, and its global demand has increased over the past few decades. To minimize faults within PCBs, many PCB manufacturers focus on understanding and preventing common defects. This understanding is essential for producing high-quality PCBs and ultimately, a high-quality PCBA product. It's important to consider these points since they directly affect the functionality and quality of the final PCB assembly. With the increasing complexity of PCBs due to technological advancements, the probability of PCB assembly failure is also higher.

This involves using powerful optical microscopes to inspect the surface layer of a PCB for corrosion, failed solder joints, shorts or opens, buildup of solid contaminants, or surface layer damage.

1. Stereo Microscope.

Mainly observe some conditions that cannot be clearly distinguished visually, such as the contamination of the PCB surface, the appearance of the solder joints, the damage and contamination of the surface of the parts, the PAD staining conditions of the dyeing experiment, etc.

2.3D Microscope

Because it can be rotated and the magnification is higher than that of a solid microscope, it can be used to observe some small conditions, and can observe the side conditions of the parts, etc.

3.Metallographic Microscope.

The magnification is high, so the microstructure of some objects can be observed, such as the observation of micro-chip samples, the measurement of IMC (Intermetallic Compound) layer thickness of solder joints, etc.

PCB manufacturers must take great care to adhere to precise specifications and tolerances to avoid any failures. Additionally, they should work with an effective PCB failure analysis to investigate any issues with the systems and components, and make necessary improvements to ensure quality.