Methods for Testing and Inspecting PCB and PCBA

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This article aims to provide answers to frequently asked questions about PCBA testing. The process involves both physical testing of components to verify that they are correctly wired and meet their specifications, as well as functional testing of products and systems to ensure they operate properly. Below are some of the commonly asked questions about the process.

The PCBA process includes SMT chip processing, DIP plug-in and PCBA testing. PCBA testing is only one link in the entire PCBA process, and it is an important means to control product quality. English translation is pcba test.

PCBA testing mainly includes five forms: ICT testing, FCT testing, aging testing, fatigue testing, and testing under harsh environments.

1. ICT test mainly includes circuit on-off, voltage and current values, fluctuation curve, amplitude, noise, etc.

2. FCT testing requires IC program firing, simulation testing of the entire PCBA board function, discovery of problems in the hardware and software, and equipped with necessary patch processing production fixtures and test racks.

3. The fatigue test is mainly to sample the PCBA board, and perform high-frequency and long-term operation of the function, observe whether there is failure, and judge the probability of failure in the test, so as to feedback the working performance of the PCBA board in the electronic product.

4. The test in harsh environments is mainly to expose the PCBA board to extreme temperature, humidity, drop, splashing, and vibration, and obtain the test results of random samples to infer the reliability of the entire PCBA board batch product.

5. The aging test is mainly to energize the PCBA board and electronic products for a long time, keep them working and observe whether there are any failures. After the aging test, the electronic products can be sold in batches.

PCBA testing can find problems in the board in time to adjust the pre-process such as SMT and DIP, optimize the process flow, and realize the quality control layer by layer with a testing chain.

There are some additional tests that can be performed on PCB assemblies besides the main ones. These tests are useful for fine-tuning the manufacturing process to produce a higher quality product.

One such test is the peel test, which measures the strength required to peel off the lamination from the PCB. Another test is the solder float test, which evaluates the thermal stress on the PCB. Solderability tests are also important, as they measure how well metal is wetted by solder and ensure surface sturdiness for reliable solder joints. The most common types of solderability tests are the "Dip and look" method, the surface mount simulation test, and the wetting balance analysis.

Micro-sectioning analysis is yet another test that analyzes the structural characteristics of solder joints and investigates defects and anomalies. This test can be applied to both surface mounting technology (SMT) and through-hole technology (THT) PCBs.

Finally, PCB contamination testing investigates corrosion, degradation, metallization, and foreign material contamination in the PCB. These types of contamination can cause short circuits and other catastrophic failures.