PCB Material Selection Guide

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When you are manufacturing a Printed Circuit Board, which can determine the success or failure of a product, it is crucial to choose the right material. The PCB material must meet quality standards while being cost-effective.

The materials that affect circuit performance and process performance are mainly dielectric materials. Therefore, the choice of PCB board is mainly to choose dielectric materials, including what should be paid attention to when choosing?

1. Glass transition temperature (Tg)

Tg is a characteristic property of polymers, a critical temperature that determines material properties, and a key parameter for selecting substrate materials. The temperature of the PCB exceeds Tg, and the thermal expansion coefficient becomes larger.

In developing countries, boards with a Tg around 135°C are usually classified as low-Tg boards; boards with a Tg around 150°C are classified as medium-Tg boards; according to the Tg temperature, PCB boards are generally divided into low Tg, medium Tg and high Tg board. The board with a Tg around 170°C is classified as a high-Tg board.

If there are many pressing times during PCB processing (more than 1 time), or there are many PCB layers (more than 14 layers), or the soldering temperature is high (> 230 ℃), or the working temperature is high (more than 100 ℃), or the soldering thermal stress is large (Such as wave soldering), high Tg plates should be selected.

2. Coefficient of Thermal Expansion (CTE)

The coefficient of thermal expansion is related to the reliability of welding and use. The principle of selection is to be consistent with the coefficient of expansion of copper to reduce thermal deformation (dynamic deformation) during welding).

3. Heat resistance

Heat resistance mainly considers the ability to withstand soldering temperature and soldering times. The actual welding test is usually carried out with slightly stricter process conditions than normal welding. It can also be selected according to performance indicators such as Td (temperature at 5% weight loss during heating), T260, T288 (thermal cracking time).

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