SMT/BGA Inspection - Precision Images for Advanced Assembly

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As an alternative to large packages with high pin counts, ball grid arrays (BGAs) have distinct benefits: smaller size, lower inductance, reduced coplanarity and lack of skewing. But once a BGA is placed, how can the integrity of its solder bond be measured?

Many manufacturers of advanced SMT assemblies rely on real-time x-ray technology to evaluate solder joint integrity for BGAs and other leadless packages that cannot be inspected by conventional vision systems. In the course of working with our systems, these manufacturers have verified a fundamental principle of productive assembly: it's more effective to inspect the process, rather than the product.

Real-time x-ray inspection helps to establish quality as an integral part of your process, right from the start, and to maintain it throughout your line, for BGA evaluation or any other aspect of the process. In the development stage, real-time x-ray inspection defines the optimal parameters required to maintain a process in control. During production audits, it ensures that those parameters are being maintained.

Kingsheng PCBA Tech has been providing PCB Assembly service in EMS industry for a decade of years. We provide flexble electronic manufacturing service with BGA inspection and repairing. Our aim is to meet customers' satisfaction by best quality and professional service.