PCBA processing BGA welding spot is not full solution

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The root cause of the BGA problem is due to inadequate solder paste. Incomplete solder joints in PCBA processing BGA repair can also be caused by the core suction phenomenon of solder. This happens when the BGA solder flows into the through hole due to capillary effect, forming incomplete solder joints. The core suction phenomenon can be caused by patch or printing tin bias, BGA pad, and defect through hole without solder film isolation. If the solder resistance film is destroyed during the repair process of BGA devices, the phenomenon of core suction will be intensified, resulting in the formation of incomplete solder joints.

1. Printing sufficient amount of solder paste;

2. Use resistance welding to cover the holes to avoid solder loss;

3. Avoid damaging the welding barrier layer in THE BGA repair stage of PCBA processing;

4. Accurate sound alignment of printing solder paste;

5. Accuracy of BGA patch;

6. Operate BGA components correctly in the repair stage;

7. Meet the coplanar requirements of PCB and BGA to avoid bending. For example, appropriate preheating can be taken in the repair stage;

One of the reasons for bad solder joints is the unevenness between the device and the PCB. Even if there is enough solder paste, if the gap between the BGA and the PCB is inconsistent, incomplete solder joints may occur, particularly with CBGA. This is known as poor coplanarity.