Analysis of common problems of PCBA in SMT patch production

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SMT patch processing is a crucial technology in the SMT process. However, the speed of patch processing can limit the production line's capacity. An SMT placement processing production line requires at least one high-speed placement machine for placing regular-size components, and a multi-function placement machine for placing special-size components. Despite its importance, various issues crop up during the SMT patch processing process.

During SMT processing and manufacturing of PCBA circuit board, some quality anomalies often occur, such as short circuit of SMT components, solder ball on the soldering plate, virtual welding and so on.

From the following common reasons, we find some ways to share with our friends these common problems in SMT patch processing.

Causes of short circuit and solutions

Modify PCB Layout with too wide/too long welding plate design

Open welding film between pads

The gap of welding plate is too small

Causes and solutions of tin beads

Solder mask printing is not good for PCB incoming material control

Remove moisture or dirt from the PCB

Causes and solutions of virtual welding

Too much pressure on the printing paste reduces the pressure on the printing spatula

Solder powder oxidation, flux change solder paste

Adjust the furnace temperature curve by heating up too quickly in preheating zone

Too fast track speed reduces the reflow track speed

During SMT processing and manufacturing of PCBA circuit boards, some quality anomalies often occur, such as short circuits of SMT components, solder balls on the soldering plate, virtual welding, and so on. After identifying common problems in SMT chip processing, we have come up with ways to share them with others.